Circuit Jet
Portable PCB Printer
Inktronix Tech
Circuit Jet - Portable PCB Printer
CircuitJet uses inkjet technology to additive manufacture PCBs at the users desktop. Can literally just print from their desktop and test same-day.
Logistics costs are drastically decreased as the boards are created on demand for the user.
Printing as easy as dragging and dropping BMP files.
Materials are non-toxic and cartridges can be recycled via traditional desktop cartridge recycling centers.
Can provide multilayer boards directly at users desktop.
Inktronix Tech
CircuitJet: CJ1000
Initial offering will be a 3.5”x5.5” PCB Printer
4 mil space and trace resolution (3 mil possible)
Includes:
Printer
Substrate Tray
USB Cable
Power Adapter
1 Cartridge (Conductive Ink Cartridge)
5 Pack Paper, 5 Pack PET, 5 Pack FR4, 5 Pack 2-Sided Paper
Touch-up and Via Filling Pen
Drag and Drop Software on USB Drive
Custom Fitted Case
Cartridge Priming Tool
Low-temperature solder (90C reflow) for component attachment to Silver Ink
Layers print in 20-30 seconds
User can iterate several revisions in a day to reach a final board design quickly
CircuitJet II (far right) can create a full CCL board to create a fully finished prototype ecosystem
Design Rules – Board Layups for CircuitJet
1 Layer | |
|---|---|
| Specialty coating to sinter silver ink | |
| Substrate (Paper, PET, FR4) | |
| Pressure Sensitive Adhesive Layer (optional) | |
2 Layer Double-sided |
|
|---|---|
| Specialty coating to sinter silver ink | |
| Substrate (Paper, PET, FR4) | |
| Specialty coating to sinter silver ink | |
2 Layer Single-sided substrate with PSA |
|---|
Multi-layer Double-sided with single-sided PSA |
|
|---|---|
| Specialty coating to sinter silver ink | |
| Substrate (Paper, PET, FR4) | |
| PSA Layer (sticks to layer underneath) | |
| Specialty coating to sinter silver ink | |
Multi-layer single-sided with PSA |
|
|---|---|
| Specialty coating to sinter silver ink | |
| Substrate (Paper, PET, FR4) | |
| Pressure Sensitive Adhesive Layer (optional) | |
Design Rules - Common Specs
Traditional | |
|---|---|
| Spec | Value |
| High Temp | Yes, >175ºC Tg |
| PCB Finish | ENIG (Gold) |
| Soldermask Type | SMOBC |
| Silkscreen Type | High Res DLP |
Circuit Jet |
|
|---|---|
| Spec | Value |
| Low Temp (direct print) High Temp (with transfer film) | <100ºC (coating degradation) >175ºC (substrate dependent) |
| PCB Finish | ENIG (Gold) |
| Soldermask Type | Inkjet Printed Ink – not necessary in all cases – printed adhesive |
| Silkscreen Type | Inkjet Printed Ink |
Design Rules - Stackup
Traditional |
|
|---|---|
| Spec | Value |
| Silkscreen | 1 mil – 25 micron |
| Soldermask | 1 mil – 25 micron |
| Top Copper | 1.4 mil – 35 micron |
| Polyimide Flexible Substrate | 4 mil – 100 micron |
| Bottom Copper | 1.4 mil – 35 micron |
| Soldermask | 1 mil – 25 micron |
| Silkscreen | 1 mil – 25 micron |
Circuit Jet |
|
|---|---|
| Spec | Value |
| Inkjet printed label | 1 micron |
| Soldermask – not necessary for every case | 1 micron |
| Top Silver – printed on demand | 1 micron |
| Polyimide Flexible Substrate | User selectable – 2-10 mil |
| Bottom Silver – printed on demand | 1 micron |
| Soldermask – not necessary for every case | 1 micron |
| Inkjet printed label | 1 micron |